Human Resources Management

ESCP Business School, the World's First Business School (est. 1819), invites applications for an open position in Organizational Behaviour/Human Resources Management at the Assistant/ Associate level. The open position is based at the Turin Campus in Italy with a starting date in September 2024 or later.About the OrganizationESCP Business School is a pan-European business school with campuses in Berlin, London, Madrid, Paris, Turin, and Warsaw, providing several master's degrees, a bachelor's degree, a PhD programme, as well as a wide range of executive education courses. Ranked No. 4 worldwide by the Financial Times (FT), the ESCP Master in Management is one of the leading degrees in its field, along with the Master in Finance (ranked 1st worldwide by FT), and the Executive MBA (ranked 5th worldwide).Job Description & QualificationsWe are looking for a candidate whose research has been (or has the potential to be) published in top-tier peer-reviewed journals. The ideal candidate shows a proven ability to deliver quality teaching, also using digital teaching methods, at both graduate and undergraduate levels.A competitive salary is offered for the position, which requires a balance among research, teaching, and school development. Fiscal incentives are offered by the Italian law to individuals relocating from abroad.Candidates should have the following characteristics:A Ph.D. in Management or in a related field.Evidence of (or clear potential to achieve) excellence in research (publications in leading journals, and/or highly innovative research).Fluency in oral and written English (other languages are not mandatory).Documents to provideApplication packages should include:Up to three recent research articles – working papers or published articlesTeaching statement, including teaching evaluations of the past two years (when available)Three letters of recommendationJob interviews will be conducted starting from December 2023.Contact :Application Procedure Candidates should submit complete application packages by filling this form by November 15, 2023.
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