Advanced Packaging Of Gan-Based Hemts

Puesto: Advanced packaging of GaN-based HEMTs Función: Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs: Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and higMasterIdiomasTAREAS/TASKS:Design, modelling, and fabrication of advanced packaging architectures for the System-in-Package (SiP) integration of GaN-based HEMTs:Optimization of various packaging architectures (wirebonding, embedded chip, and flip-chip) for high frequency and high power operationSynthesis of high thermal conductivity AlN and AlScN layersIntegration of AlN and AlScN as interposers and heat dissipation layersHABILIDADES-CUALIFICACIONES/SKILLS-QUALIFICATIONS:MS Office, Latex, Adobe Illustrator, AutoCADPrevious experience on programming (Python, C, LabVIEW, etc) and scientific (Mathematica, Matlab, Origin, etc) or simulation (COMSOL, etc) software will be highly valuedCandidates must hold a Master Degree in Electronic/Telecommunication/Materials Engineering or PhysicsProficiency in EnglishGoal-oriented mindset, creativity, teamwork & communication skillsPrevious research experience will be highly valuedBENEFICIOS/BENEFITS:The hired researcher will pursue an industrial PhD in a joint program with INDRA Sistemas S. A., a Spanish multinational company, within the project "Chair UPM-INDRA in Microelectronics".Health and social benefits according to Spanish law.CRITERIOS Y PROCESO DE SELECCION/ELIGIBILITY CRITERIA AND SELECTION PROCESS:Applicants should send a motivation letter & CV to both Marta Clement (******) and Jorge Pedrós (******).#J-18808-Ljbffr