Staff Package Engineer-High Power | [V156]

Job Summary: This position is responsible for the definition and development of high power/high voltage semiconductor packages. Job duties include the definition, analysis, simulation, and verification for new product package designs, generating and reviewing CAD models and drawings.
Essential Functions:
Work with technology development, technical marketing, and outside contractors including OSATs to define package specifications.Execute package development optimizing for manufacturability, reliability, time to market, and cost.Execute package performance optimization including but not limited to thermal, power density, footprint, and scalability; provide design specifications and BOM.Provide design risk assessments, mitigation plans, development lessons learned, and proof of concepts.Keep up to date with developments in the industry and competitive developments and define high power packaging roadmap for the company.Qualifications:
MSEE or higher in electrical/mechanical/material engineering.Strong technical background in high voltage discrete or power modules including thermal analysis, failure analysis, and metrology tools.Deep understanding of semiconductor device fabrication and assembly technology.Experience working with wide band gap power devices (SiC/GaN) is a plus.Experience in automotive power is a plus.Advanced knowledge of elasticity, plasticity, failure, and heat transfer in materials/structures.Advanced knowledge of materials properties and associated analytical models used in mechanical engineering problem solving.Knowledge of JEDEC, IEC, IPC, and AEC standards are desired.Education: MSEE or higher.
Location: EU, US, China.

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